US 2,004,034,346 · Filed 2003-03-25
RF device with thermo-electric cooler
An RF device includes a support structure. An RF electrode is coupled to the support structure and includes conductive and dielectric portions. A thermo-electric cooler is coupled to the support structure and is configured to cool a back surface of the RF electrode.
Patent details
- Publication number
- US 2,004,034,346
- Filing date
- 2003-03-25
- Grant date
- Application — not yet granted
- Assignee
- Stern Roger A. / Mitchell Levinson / Bryan Weber
- Inventor(s)
- STERN ROGER A., LEVINSON MITCHELL, WEBER BRYAN
- CPC class
- A61N1/328
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