US 6,902,116 · Granted 2005-06-07
Method for making a financial transaction card with embedded electronic circuitry
Financial transaction and similar cards are fabricated with a split core adapted to received embedded electronic circuitry. The card core has two or more laminated layers. The cavity is milled into one or more of the layers to receive the electronic circuitry. The core layers are then laminated together, along with protective overlays. Alternative fabrication methods include co-extrusion and injection molding.
Patent details
- Publication number
- US 6,902,116
- Filing date
- 2002-11-20
- Grant date
- 2005-06-07
- Assignee
- Innovative Card Technologies, Inc.
- Inventor(s)
- FINKELSTEIN ALAN
- CPC class
- G06K19/07
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