US 6,048,379 · Granted 2000-04-11
High density composite material
The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.
Patent details
- Publication number
- US 6,048,379
- Filing date
- 1997-06-27
- Grant date
- 2000-04-11
- Assignee
- Ideas To Market, L.P.
- Inventor(s)
- BRAY; ALAN V., MUSKOPF; BRIAN A., DINGUS; MICHAEL L.
- CPC class
- C22C49/10
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